ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,765, issued on Oct. 6, was assigned to SERIPHY TECHNOLOGY Corp. (Hsinchu County, Taiwan). "Semiconductor packages, semiconductor device and ... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,766, issued on Oct. 6, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Eiji Kuwahara (Kyoto, Japan), To... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,767, issued on Oct. 6, was assigned to INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES (Guangzhou, China). "Chiplet-fine-intercon... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,768, issued on Oct. 6, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo). "Semiconductor module" was invented by Yuji Morin... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,769, issued on Oct. 6, was assigned to SHINDENGEN ELECTRIC MANUFACTURING Co. LTD. (Tokyo). "Semiconductor module" was invented by Yuji Morin... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,771, issued on Oct. 6, was assigned to AT & S Austria Technologie & Systemtechnik AG (Leoben, Austria). "IC substrate with support structure... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,772, issued on Oct. 6, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China). "Composite substrate, manufacturing method thereof, and se... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,773, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure including a package... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,774, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.). "Silicon nitride layer under a copper pad" was invented by Brandon... और पढ़ें
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,775, issued on Oct. 6, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board and semiconductor package comprising same" w... और पढ़ें